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XC7A100T-2FGG676可编程逻辑
XC7K325T-2FFG676I逻辑芯片
单片机芯片XC7K325T集成电路
XC3S1400AN-4FGG676I渠道直销
XCKU5P-2FFVB676I可编程逻辑
测试座老化座定制夹具治具
XC3S1400AN-4FGG676I XC3S1400AN-4FGG676C BGA全新原装进口芯片
XC5VLX30-1FFG676C原装渠道直销
XC6SLX150T-3FGG676C渠道直销
XC7K70T-2FBG676I原装渠道直销
XC7Z035-FFG676ABX植锡BGA676钢网XC7A100T-2FGG676I植球激光钢片
XC7Z030-2FFG676I原装渠道直销
XCKU035-2FBVA676I原装渠道直销
XC6SLX100-2FGG676I渠道直销
XC7K325T-1FFG676C原装渠道直销
XC7K325T-2FFG676I 封装BGA-676 原装可编程门阵列嵌入式FPGA芯片
XC7A100T-2FG676C XC7A100T-2FG676I 封装BGA IC芯片
单片机6(MCU/MPU/SOC) XC7Z030-1FFG67 IXC7Z原0FC30 BGA-676KSV
XC5VLX50-1FFG676C XC5VLX50-1FFG676I BGA676 集成IC*
XC7Z030-2FFG676I 2E 1C 1I XC7Z035 XC7Z045 封装BGA676 原装***
XC7Z035-2FFG676I 原装正品封装BGA676 嵌入式FPGA可编程逻辑芯片
全新正品XCKU035-2FBVA676I XCKU035-2FBVA676E可编程逻辑器件BGA
XC6SLX150-1FGG676C 1FGG676I封装BGA676 CPLD复杂可编程逻辑器件
XCV100E-6BGG352C 6BGG352I封装BGA-676 FPGA现场可编程门阵列IC
XC3S1400AN-4FG676C 4FG676I 封装BGA676 FPGA现场可编程门阵列
XCV400E-8FGG676C 8FGG676I 封装BGA676 FPGA现场可编程门阵列
XC4VLX25-12FF676C 12FF676I封装BGA676 FPGA现场可编程门阵列IC
XC3S4000-5FGG676C 5FGG676I 封装BGA676 可编程逻辑IC 现货
新品XC6SLX150-1FGG676C 1FGG676I封装BGA676 CPLD复杂可程式设计
BGA676测试座老化座测试架定制夹具治具测试架烧录座插座SOCKET座
芯片座测试治具烧录座定制SOCKET
TI原装测试座 烧写座 FBGA676-027A 烧录座 间距1.0MM BGA676插座
XC6SLX150-3FGG676C XC6SLX150-3FGG676I 676-BGA封装*
XC2VP20-5FG676I XC2VP20-5FG676C BGA IC芯片*
XC3S2000-4FGG676I XC3S2000-4FGG676C BGA封装 IC芯片 质量保证*
BCM53262MKPBG 封装BGA676 接口 - 控制器 IC芯片*
XC6SLX150-2FGG676C XC6SLX150-2FGG676I 封装BGA676 IC芯片*
XC6SLX45-3FG676C BGA封装 集成IC 质量保证*
XC2VP30-6FG676I 一站式专业BOM表配单服务 BGA676*
XC6SLX150-3FG676I XC6SLX150-3FG676C BGA676 IC芯片*
XC3SD1800A-4FGG676C XC3SD1800A-4FGG676I BGA676 IC集成*
原装芯片(IC)DS34S132GN+/IC TDM OVER PACKET 676-BGA
XC6SLX75T-3FGG676C BGA676可编程逻辑IC芯片
XC6SLX150-2FGG676I BGA 可编程逻辑器件 全新正品 原装
XC7K160T-2FFG676I BGA676可编程逻辑IC
全新原装 XC7Z035-2FFG676I XC7Z035-2FFG676C BGA676 嵌入式芯片
全新原装 XC2VP30-5FGG676C XC2VP30-5FGG676I BGA-676可编程芯片
XC7A200T-1FBG676C BGA-676 可编程门阵列IC芯片 全新原装 正品
IC集成电路FPGA XC7A200T-2FBG676C 全新原装正品 BGA
XC3S1400A-4FGG676C BGA 可编程门阵列芯片 全新正品 原装
ONEHONG全新原装正品XC7A100T-2FGG676I可编程逻辑IC 封装BGA-676
全新 XC7K325T-3FFG676C XC7K325T-3FF676C BGA676 嵌入式 芯片IC
小众高货全新 XC7K325T-3FFG676C XC7K325T-3FF676C BGA676 嵌入
全新原装 XC7A100T-2FGG676I/C BGA-676 嵌入式-FPGA可编程芯片IC
XC3S2000-4FGG676C XC3S4000-5FGG676I ADSP-BF536BBCZ-4B封装BGA
XC6SLX150T-3FG676 CIVI XC6SLX150TFG676 CIV BGA封装新的
现货包邮全新原装BGA676集成电路
现场可编程门阵列原装现货已测试
XC6SLX100-2FG676I BGA-676 Xilinx/赛灵思IC FPGA芯片
XILINX/赛灵思XC5VLX30BGA
XILINX可编程逻辑器原装正品
XC7S75-2FGGA676C Xilinx/赛灵思IC FPGA芯片 BGA封装
XC6SLX100T-2FG676I BGA-676 Xilinx/赛灵思IC FPGA芯片
XC7K160T-1FFG676C Xilinx/赛灵思IC FPGA芯片 BGA封装
XC6SLX100-2FG676C BGA-676 Xilinx/赛灵思IC FPGA芯片
XC6SLX100-3FGG676I BGA-676 Xilinx/赛灵思IC FPGA芯片
XC6SLX100-3FGG676C BGA676 全新原装 可编程主控处理器 现货供应
全新原装可编程逻辑器
XC6SLX45-2FG676I BGA-676 赛灵思FPGA芯片/Xilinx 可编程IC
XC7Z035-1FFG676I Xilinx/赛灵思IC FPGA芯片 BGA封装
XCKU3P-2FFVA676I Xilinx/赛灵思IC FPGA芯片 BGA封装
XC6SLX100-3FG676I BGA-676 Xilinx/赛灵思IC FPGA芯片
DS34S132GN+原装正品芯片/IC TDM OVER PACKET 676-BGA
3M进口原装BGA676测试座 2676-9318-00-2401 1.0MM间距
TI原装测试座 烧写座 FBGA676-027A 烧录座 间距1.0MM BGA676
XC7A200T-2FBG676I XC7A200T-2FBG676C BGA封装 IC芯片*
XC7A100T-2FG676C XC7A100T-2FG676I 封装BGA IC芯片*
XC7A200T-2FBG676I 现场可编程门阵列 XC7A200T 贴片BGA-676 全新
XC6SLX150-3FGG676I 现场可编程门阵列 XC6SLX150 贴片BGA-676
XC7A100T-2FGG676I 现场可编程门阵列 XC7A100 贴片BGA-676 全新
XC3S1000-4FGG676I XC3S1000-4FGG676C 676-BGA封装 质量保证*
XC7K325T-1FFG676I/2FFG676C嵌入式FCBGA-FPGA编程门阵列 BGA-676
XC2VP30-5FG676C BGA封装 价格咨询为准 现货库存保质量*
XC3S1400A-4FG676I XC3S1400A-4FG676C BGA676封装 IC质量*
DS34S132GN+ 芯片「IC TDM OVER PACKET 676-BGA」
AM显D卡芯片美时龙 XC7K70T XC7K70T BGA676主板集成电路 BGA封装
集成IC电路芯片原装拆机
XC6SLX150-3FGG676C BGA676现场可编程门阵列
XC6SLX100T-2FGG676I BGA676现场可编程门阵列
XC7K70T-3FBG676E BGA676现场可编程门阵列
